Anti-Virus material

Anti-virus material

• Virus blocking function
• Virus extinction function

Silver or copper plasma deposition

• The physical vapor deposition method is a low-temperature process compared to the chemical vapor
  deposition (600~1,000℃ or higher) method, and the range of materials is wide, and it is eco-friendly because it does not use harmful gases.
• The sputtering deposition process equipment can apply a variety of samples compared to thermal evaporation and electron beam deposition, and it goes through the process with the best deposition uniformity, density, and adhesion rate due to the collision of atoms with high energy.

Growth inhibition and sterilization through ion reaction

• Suppress proliferation and killing of viruses through plasma deposition of silver or copper